Assembly and Operation Manual
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This document describes the various simple PCBs used to convert a (usually
laser) beam into two electrical signals, typically differentiated by
polarization or phase. Common to all are that there are locations for two
bare photodiodes and for a plate or cube beam-splitter. The electrical
output is the photo-current which may be used directly with a load
resistor. Minor modifications are required to use these with the AB2 pre-amp.
There are several versions of these PCBs but all have the following:
The photos below show some of the versions of the DP1 PCBs in various stages
of assembly.
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2. There is no charge except to cover the costs of copying.
DISCLAIMER
SG-DP is intended for use in hobbyist, experimental, research, and other
applications where a bug in the hardware will not
have a significant impact on the future of the Universe or anything else.
We will not be responsible for any consequences
of such bugs including but not limited to damage to the wafer FAB you
picked up on eBay for $1.98 + shipping, financial loss from the use of
37 spools of ABS due to the office 3-D printer fabricating a part 25.4x
too large in all dimensions, or bruising to your pet's ego from any number
of causes directly or indirectly related to SGPD1. ;-)
Introduction
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Various SG-DP1 PCBs: Single Channel, Two Channel, with PBS and Beam from Behind, QD1 Modified for AB2, Mounted on KMS, QD1 Quad Decoder using AP and bits of CP Sheet
Specifications
The PCB designations are kind of arbitrary. ;-)
Theory of Operation
The type of detector use here is called a "biased photodiode" and is
essentially a current source with an output proportional to incident
optical power.
A silicon photodiode (PD) when reverse biased by a positive DC voltage (battery or power supply) allows a current (designated Ipd) to flow with a sensitivity measured in amps / watt (A/W) or for our purposes, mA/mW of incident laser power. The sensitivity for silicon at 633 nm is typically between 0.3 and 0.4 mA/mW and linear up to several mW for the types of PDs used here. This relationship holds even when a load resistor R-Load is installed between the PD and circuit common (negative of the bias supply), resulting in an output voltage that is linear with respect to incident laser power based on Ipd * R-Load. For example, with a laser power of 0.5 mW, a PD sensitivity of 0.35 mA/mW, and R-Load of 10K ohms, Vo would be 1.75 V.
The most basic circuit is shown below:
Silicon Photodiode +---------|<|-------+-------o Output to scope or DMM | Cathode Anode | | / | \ R-Load | / | Bias Supply \ | +| | - | +--------||||-------+-------o GND / Common / Return | |
Note the polarity of the PD with its cathode connected to the positive of the power supply and thus reverse biased. With no light incident on the PD, only the so-called "dark current" will flow, which is generally small enough to be ignored (nanoamps or less).
Circuits like this are used in commercial detectors like the Thorlabs DET110 and for DP1 as well. With the PD back-biased, the load can be an actual resistor as shown or the inverting input of an op-amp with its non-inverting input tide to 0 V / GND.
The PD1 PCBs include only the photodiodes, R-Protect, and an AC bypass capacitors as shown in the schematic below.
R-Protect PD1 J1-3 Vb+ >-----/\/\-----+----|<|-----<<------------+----------o Output 1 | | | PD2 J1-4 | +----|<|-----<<----------------+------o Output 2 | | | | / / _|_ R-Load1 \ \ R-Load2 --- / / | \ \ | J1-2 | | +------------<<------------+---+------o Ground |<----- SBB or QDx PCB ----->|<---- Output / Power Wiring ----->
The graphics below show the layout diagrams for the various versions of the PCB with the parts installed:
To use these PCBs for a quad decoder requires an optical setup such as one of the following:
The left diagram is the classic arrangement with a plate-type Non-Polariziing Beam-Splitter (NPBS) at 45 degrees. An NPBS cube could also be used.
The center and right diagrams use a variable Attenuator Plate (AP) in place of the NPBS, primarily due to cost. But so as not to mess with the polarization too much, it is set at a small angle, so its photodiode needs to be mounted at a different location. The difference between the two diagrams is only in the arrangement of the LPs and QWP: The one on the right can use the same type of CP sheet for both.
Prt Description Comments ------------------------------------------------------------------------- - PCB, Various First released version C1 Capacitor, 0.1 µF AC bypass R1 Resistor, 1K, 1/8 W PD protect (current limiting) SKT1 Female-male socket, 2 pins For PD1 SKT2 Female-male socket, 2 pins For PD2 PD1 Silicon photodiode, Osram Optical sensor 1 SFH206K or similar PD2 Silicon photodiode, Osram Optical sensor 2 SFH206K or similar J1 Header/shell/pins or Screw Power / signal terminal block, 4 pin BS1 Beam-splitter Type depends on specific application
Almost any relatively small-area silicon photodiode will suffice for PD1 and PD2. Those that are known to be satisfactory include the Everlight PD438C/S46, Excelitas VTD206KH, OSRAM SFH-206K, and Vishay BPW46, all have an active area of 7-8 sq. mm with a side-facing planar entrance surface. Where the beam incident on the photodiode is larger, a focusing lens can be used to reduce it, or where there is plenty of power, simply live with the proportional reduction in sensitivity. The kit PDs are currently the OSRAM SFH-206K.
Other bits may be required like pieces of CP or LP sheet, a spacer or washer for raising the beam-splitter, and a mounting screw and spacer.
All electrical components are through-hole.
A low power soldering iron with narrow tip and thin (e.g., #22 AWG) rosin-core solder will be required. DO NOT even think about attempting this without suitable soldering equipment. It's well worth the investment. A Weller soldering gun or propane torch will not work. :) Rosin core solder is also essential. And while I'm quite confident that you never make mistakes, a means of component removal such as a de-soldering pump (e.g., a full size SoldaPullt™) will be highly desirable. Screwing up component removal can easily ruin the PCB and is not covered under the limited unlimited warranty. :-)
Proper soldering technique will be such that the exposed solder on each pad should be shiny with a concave profile. It should not be a blob and just needs to fill the hole. Solder is not glue. Some excess solder doesn't hurt anything but looks unprofessional. A 10X magnifier may come in handy for inspection. Residual rosin can be cleaned off with isopropyl alcohol or an environmentally-friendly electronic solvent. However, leaving the rosin alone is also acceptable (if ugly).
Total assembly time should be well under 7 minutes for someone proficient in fine soldering. Cutting component leads to 1/4 to 3/8 inch before installation will simplify soldering as the long leads won't be poking you in your one good eye. :( :) Then trim flush after soldering.
For mostly friendly tech support, feel free to contact me via the link at the top of this page. ;-)